Moldex3D :: 塑胶射出成型CAE模流软体品牌 | Molding Innovation

Tags: Digital Twin IC封装 LSR PU发泡 T0量产产业趋势光学产业可变模温复合材料多材质异型水路成型缺陷挤出成型机台鉴定材料量测与特性案例分享模具产业模具设计橡胶橡胶及热固性材料汽车产业热浇道熔接线电子产业网格修复翘曲变形联合仿真船舶产业虚实整合软件操作技巧连接器

Digital Twin Series – Moldex3D: Perfect Integration of Smart Design and Smart Manufacturing

Digital Twin Series – Tamkang University: Using CAE to Perform Design of Experiment (DOE) Optimization in Injection Molding is a Dream?

Digital Twin Series – SimpaTec: From Process to Mechanics – The Development of Foam Injected Molding Parts by using Simulation and its Optimization

Digital Twin Series – Saeilo: The Honor of Aoki Katashi Innovation Award: Development of Microcellular Foam Injection Molding Simulation Technology Incorporating Bubble Nucleation

Digital Twin Series – Objectify: Additive Manufacturing — Conformal Cooling

Digital Twin Series – BlackCAD: Moldex3D-aided Metal to Plastic Replacement in Automotive Underhood Applications

Digital Twin Series – e-Xstream: How ICME Can Break the Silos inside the Company and Push Digital Twin to Maximum ROI?

Digital Twin Series – Fujitsu: DOE Meets IOT: An Approach to Apply Design of Experiments to Digital Twins with the Industrial of Things

Digital Twin Series – LATI: Optimize Heat Management with Different Thermally Conductive Compounds

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